CMPD2836E TR PBFREE

CMPD2836E CMPD2838E ENHANCED SPECIFICATION SURFACE MOUNT DUAL, SILICON SWITCHING DIODES SOT-23 CASE w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPD2836E and CMPD2838E are Enhanced versions of the CMPD2836 and CMPD2838 High Speed Switching Diodes. These devices are manufactured by the epitaxial planar process, in an epoxy molded surface mount SOT-23 package, designed for high speed switching applications. FEATURED ENHANCED SPECIFICATIONS: ♦ BVR from 75V min to 120V min. ♦ The following configurations are available: CMPD2836E DUAL, COMMON ANODE CMPD2838E DUAL, COMMON CATHODE MAXIMUM RATINGS: (TA=25 °C) ♦ Peak Repetitive Reverse Voltage Average Forward Current Peak Forward Current, tp=1.0s Power Dissipation Operating and Storage Junction Temperature Thermal Resistance VF from 1.2V max to 1.0V max. MARKING CODE: CA2E MARKING CODE: CA6E SYMBOL VRRM IO IFM PD TJ, Tstg ΘJA 120 200 300 350 -65 to +150 357 ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX ♦ IR VR=80V 100 ♦ BVR IR=100µA 120 150 ♦ VF IF=10mA 0.72 0.85 ♦ VF IF=50mA 0.84 0.95 ♦ VF IF=100mA 0.92 1.0 CT VR=0, f=1.0MHz 1.5 4.0 trr IR=IF=10mA, RL=100Ω, Rec. to 1.0mA 4.0 UNITS V mA mA mW °C °C/W UNITS nA V V V V pF ns ♦ Enhanced specification R3 (25-January 2010) CMPD2836E CMPD2838E ENHANCED SPECIFICATION SURFACE MOUNT DUAL, SILICON SWITCHING DIODES SOT-23 CASE - MECHANICAL OUTLINE PIN CONFIGURATIONS CMPD2836E CMPD2838E LEAD CODE: 1) Cathode D2 2) Cathode D1 3) Anode D1, D2 LEAD CODE: 1) Anode D2 2) Anode D1 3) Cathode D1, D2 MARKING CODE: CA2E MARKING CODE: CA6E R3 (25-January 2010) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)